Post B4tl7qqWG8m74QWr9U by natanbc@mastodon.social
 (DIR) More posts by natanbc@mastodon.social
 (DIR) Post #B4tNK8g3OKGmwpxaHw by niconiconi@mk.absturztau.be
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       Appnote: Keep the bypass capacitor as close as possible to minimize impedance.Me: *Solder 0603 capacitors directly onto the chip package between adjacent VCC/GND pins.* Fine, now it's as low as DIP's bond wires allow. ​:blobcatlul:​
       
 (DIR) Post #B4ta7EkUnwxtQ0DRzs by anymouse_404@glitch.social
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       @niconiconi They should really do this right onto the leadframe, during packaging, before casting the resin
       
 (DIR) Post #B4ta7Exc1BSO4gLvRQ by niconiconi@mk.absturztau.be
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       @anymouse_404@glitch.social They sometimes do, but they charge 10x the price for that IC.
       
 (DIR) Post #B4taIP012CYOOWncGG by azonenberg@ioc.exchange
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       @niconiconi @anymouse_404 wait what i have never seen leadframe mounted passives.i've seen SiPs with a FR4 substrate that had a wirebonded die and a bunch of passives overmolded in resin, though
       
 (DIR) Post #B4tcmC3DwLeMpedJYG by niconiconi@mk.absturztau.be
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       @azonenberg@ioc.exchange @anymouse_404@glitch.social Right, on the substrates of more modern packages, not on the DIP lead frames, e.g. ADI "Silent Switcher 2" series placed capacitors on the package via the substrate of the flip-chip QFN. (is it lumped or built into the substrate? Hard to see from this photo). https://www.analog.com/en/resources/analog-dialogue/articles/is-it-possible-to-fit-low-emi-power-supplies-onto-crowded-boards.html
       
 (DIR) Post #B4tl7qqWG8m74QWr9U by natanbc@mastodon.social
       1 likes, 1 repeats
       
       @azonenberg @niconiconi @anymouse_404 I've seen a resistor on a random SMPS controller chip (https://www.lcsc.com/product-detail/C78753.html)