[HN Gopher] Hybrid Bonding: 3D Chip Tech to Save Moore's Law
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       Hybrid Bonding: 3D Chip Tech to Save Moore's Law
        
       Author : rbanffy
       Score  : 4 points
       Date   : 2024-06-05 11:24 UTC (1 days ago)
        
 (HTM) web link (spectrum.ieee.org)
 (TXT) w3m dump (spectrum.ieee.org)
        
       | causality0 wrote:
       | How do they solve the problem of doubling the component count
       | without reducing the node size also doubling the power
       | consumption and heat generation?
        
         | wmf wrote:
         | They don't. You get twice the transistors, twice the power, and
         | more than twice the cost (because the bonding itself costs
         | money). See GPUs where power is increasing from 700 W to 1500
         | W. Moore's Law without Dennard scaling is kind of meh. You do
         | save on networking because you need fewer servers.
        
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       (page generated 2024-06-06 23:01 UTC)