[HN Gopher] Iris (Infra-Red, in Situ) Silicon Verification Proje...
       ___________________________________________________________________
        
       Iris (Infra-Red, in Situ) Silicon Verification Project Updates
        
       Author : pabs3
       Score  : 68 points
       Date   : 2024-03-10 09:52 UTC (13 hours ago)
        
 (HTM) web link (www.bunniestudios.com)
 (TXT) w3m dump (www.bunniestudios.com)
        
       | peter_d_sherman wrote:
       | From the earlier blog post:
       | 
       | https://www.bunniestudios.com/blog/?p=6712
       | 
       | >"This post introduces a technique I call "Infra-Red, In Situ"
       | (IRIS) inspection. It is founded on two insights: first, that
       | silicon is transparent to infra-red light; second, that
       | 
       |  _a digital camera can be modified to "see" in infra-red, thus
       | effectively "seeing through" silicon chips._
       | 
       | We can use these insights to inspect an increasingly popular
       | family of chip packages known as Wafer Level Chip Scale Packages
       | (WLCSPs) by shining infrared light through the back side of the
       | package and detecting reflections from the lowest layers of metal
       | using a digital camera. This technique works even after the chip
       | has been assembled into a finished product. However, the
       | resolution of the imaging method is limited to micron-scale
       | features."
       | 
       | This seems to be a set of ideas that is on the right track -- it
       | would be interesting to know the minimum size of chip features
       | that Infrared Light will work on, and upon knowing this, to try
       | to improve upon that by using other wavelengths (i.e., UV, EUV,
       | ?), types of light (i.e., infrared or other wavelength laser),
       | and/or other beam lensing/focusing/detecting techniques...
       | 
       | Perhaps in the future, IC shells will be made of materials that
       | not only perform the functions that they do now (heat
       | dissipation, etc.) -- but are also friendly to different types of
       | EM wavelengths (i.e., higher wavelengths to allow scanning of
       | smaller feature sizes) that could be used for
       | visualization/verification of the underlying electronic
       | components and circuits...
       | 
       | Anyway, this set of ideas will probably be refined and expanded
       | upon in the future...
       | 
       | The ultimate future goal would be a device which could read the
       | internal circuitry of any chip at any time with absolute fidelity
       | -- regardless of how tiny the components and circuits of that
       | chip might be...
        
         | kurthr wrote:
         | Cameras similar to this have been around for decades, but they
         | weren't as automated, and they were more expensive since they
         | had longer Depth of Field for research purposes. But
         | fundamentally, putting an IR back (or front) illuminator on a
         | microscope with IR lenses and a CCD was necessary and available
         | for wafer stacking decades ago (I used them in the early 90s).
         | This looks like it has a motion stage and automated scanning,
         | which is important for doing the verification!
         | 
         | I don't think you're going to get crazy high resolution. The
         | minimum wavelength of light that goes through silicon at even
         | 0.5% (it's >50% down to 1.2um) is ~0.9um. There are specialized
         | techniques (top illumination) for super-resolution like
         | confocal microscopy that can get quarter-eighth wavelength
         | ~120nm as described below, but that's about it. A bigger issue
         | will be that, if there is too high a density of metal, you just
         | won't be able to see through. However, you will almost
         | certainly be able to see the large features, the structural
         | areas (RAM/Logic/Serial) for identification, and the Through
         | Silicon Vias (TSV) used for aligning die together for MCM, but
         | not the underlying logic.
         | 
         | https://www.tydexoptics.com/materials1/for_transmission_opti...
         | 
         | https://www.photometrics.com/learn/spinning-disk-confocal-mi...
         | 
         | The resolutions needed for reverse engineering will still rely
         | on layer etching/removal and SEM.
        
           | nonrandomstring wrote:
           | What a super important project! Very well done to the
           | researchers and I really, really hope you get funding and/or
           | people joining and taking this all the way. Please keep it
           | up!
           | 
           | Been involved with a physical supply-chain assurance
           | technology project and this is the first time I heard of this
           | kind of IR chip scanning.
           | 
           | For those that don't understand; securing the provenance of
           | physical hardware is the foundation of all other
           | cybersecurity.
           | 
           | VCs and money people... this is where you should be placing
           | your bets!
           | 
           | It doesn't actually matter if/that it's not terribly
           | effective at the moment. Keep building and roll it out. Get
           | people using cheap scanners and publish open hash databases.
           | Even with false positives it becomes like "effective security
           | theatre" and is a _massive_ deterrent to anyone attempting
           | implants or stealth logic modification at silicon or board
           | level.
        
             | kurthr wrote:
             | That's "bunnie" Andrew Huang. He's great and been working
             | on this for a long time!
        
         | s0rce wrote:
         | Isn't the idea with IR that you can transmit through the
         | silicon and part of the package. There are slightly higher
         | resolution options like IR confocal microscopes
         | https://www.wdidevice.com/products/ and X-ray can do some
         | similar stuff.
        
       ___________________________________________________________________
       (page generated 2024-03-10 23:00 UTC)