https://www.electronicsweekly.com/news/business/hynix-launches-321-layer-nanzd-2024-11/ * About Us * Contact Us * Advertise * Newsletter sign-up * Login / Register Electronics WeeklyElectronics Weekly Electronics Design & Components Tech News * * News * Business + Manufacturing + Distribution + Finance + Market Research + Information Technology * Markets + AI + Automotive Electronics + Embedded Systems + Industrial Electronics + Internet of Things + Medical Electronics + Military/Aerospace Electronics + Power * Design + Communications + EDA and IP + Legislation & Skills + Research + STEM Education + Testing + University Electronics * Products + Analogue / Linear / Mixed Signal ICs + FPGA / PLD + LED Lighting + Microprocessors + Power Supplies + Raspberry Pi Development + RF & Microwave + Sensors & Opto + Single Board Computers + Test & Measurement * Blogs + Electro Ramblings + Engineer In Wonderland + Gadget Master + Mannerisms + Viewpoints + Led Luminaries * Resources + EW Digital Editions + EW Compare - Comparison Search Engine + EW-TV + Component search engine + Whitepapers, competitions & podcasts * Events + Calendar + Electronica + Electronics Weekly's Elektra Awards + Electronics Weekly's BrightSparks Awards + Electronics Weekly Women Leaders in Electronics Awards + Embedded World * Jobs [Search... ] Home >> News >> Business Add to Bookmarks By David Manners Posted on 22nd November 2024 | Modified on 21st November 2024 Hynix launches 321-layer NAND Hynix has started mass production of the world's first 321-layer NAND - a triple level cell-based 4D memory with 1Tb capacity. Following its launch of a 238-layer NAND in June last year, Hynix has become the world's first supplier of tNAND with over 300 layers by finding a technological breakthrough for stacking. The 321-layer device offers a 12% improvement write time and a 13% improvement in read time. Compared to the 238-layer device. The company plans to provide the 321-layer products to customers from the first half of next year. [IMG_0492-1024x640] Stacking more than 300 layers came into reality as the company successfully adopted the "3 plugs" process technology. The process connects three plugs through an optimised follow-up process after three times of plug processes are finished. For the process, Hynix developed a low-stress material, while introducing the technology that automatically corrects alignments among the plugs. With the adoption of the same development platform from the 238-high NAND on the 321-high product, the company could also improve the productivity by 59%, compared with the previous generation, by minimizing any impacts from a process switch. Recommended Articles * IMG_0222-300x200.jpeg Mixed outlook for semis in 2025 * IMG_0215-300x200.jpeg Trends by TrendForce * IMG_0221-300x200.png Sondrel embarks on HPC project * IMG_0544-300x200.webp High end router revenues decline for fifth consecutive quarter 2024-11-22 David Manners * tweet * * * Get Electronics Weekly every day [ ] Subscribe Previous: High end router revenues decline for fifth consecutive quarter Next: Sondrel embarks on HPC project Leave a Reply Cancel reply Your email address will not be published. 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