https://www.anandtech.com/show/21241/tsmc-2nm-update-two-fabs-in-construction-one-awaiting-government-approval [p] [logo2] [ ] [search] Welcome Log out Login Register [icon-twitt] [icon-faceb] [icon-rss] * ABOUT * BENCH * FORUMS * PODCAST [logo_resp] [ ] [search] ABOUT BENCH FORUMS PODCAST LOGIN REGISTER PC ComponentsV * CPUs * GPUs * Motherboards * SSDs * Cases/Cooling/PSUs * Memory * NAS * Storage Smartphones & tabletsV * Smartphones * Tablets * Huawei * HTC * Samsung * Google/Android * Microsoft * Apple * SoCs SystemsV * Notebook Reviews * Desktop Reviews * Mac Reviews * Ultrabooks ENTERPRISE & IT GUIDESV * Best CPUs * Best SSDs * Best Laptops * Best Android Phones * Best Video Cards * Best PSUs * Best Motherboards * Best Gaming Laptops * Best Mechanical Keyboards * Best Consumer HDDs DEALS * Home> Semiconductors [ ] Menu * PC ComponentsV + CPUs + GPUs + Motherboards + SSDs + Cases/Cooling/PSUs + Memory + NAS + Storage * Smartphones & tabletsV + Smartphones + Tablets + Huawei + HTC + Samsung + Google/Android + Microsoft + Apple + SoCs * SystemsV + Notebook Reviews + Desktop Reviews + Mac Reviews + Ultrabooks * Enterprise & IT * GuidesV + Best CPUs + Best SSDs + Best Laptops + Best Android Phones + Best Video Cards + Best PSUs + Best Motherboards + Best Gaming Laptops + Best Mechanical Keyboards + Best Consumer HDDs * Deals * TRENDING TOPICS * CPUs * Intel * AMD * GPUs * Storage * Mobile * Trade Shows * Smartphones * Motherboards * Home> * Semiconductors TSMC 2nm Update: Two Fabs in Construction, One Awaiting Government Approval by Anton Shilov on January 19, 2024 11:15 AM EST * Posted in * Semiconductors * TSMC * 2nm * N+2 * N2P 12 Comments | Add A Comment 12 Comments + Add A Comment [tsmc-wafer] When Taiwan Semiconductor Manufacturing Co. (TSMC) is prepping to roll out an all-new process technology, it usually builds a new fab to meet demand of its alpha customers and then either adds capacity by upgrading existing fabs or building another facility. With N2 (2nm-class), the company seems to be taking a slightly different approach as it is already constructing two N2-capable fabs and is awaiting for a government approval for the third one. We are also preparing our N2 volume production starting in 2025," said Mark Liu, TSMC's outgoing chairman, at the company's earnings call with financial analysts and investors. "We plan to build multiple fabs or multiple phases of 2nm technologies in both Hsinchu and Kaohsiung science parks to support the strong structural demand from our customers. [...] "In the Taichung Science Park, the government approval process is ongoing and is also on track." TSMC is gearing up to construct two fabrication plants capable of producing N2 chips in Taiwan. The first fab is planned to be located near Baoshan in Hsinchu County, neighboring its R1 research and development center, which was specifically build to develop N2 technology and its successor. This facility is expected to commence high-volume manufacturing (HVM) of 2nm chips in the latter half of 2025. The second N2-capable fabrication plant by is to be located in the Kaohsiung Science Park, part of the Southern Taiwan Science Park near Kaohsiung. The initiation of HVM at this plant is projected to be slightly later, likely around 2026. In addition, the foundry is working to get government approvals to build a yet another N2-capable fab in the Taichung Science Park. If the company starts to construct this facility in 2025, the fab could go online as soon as in 2027. With three fabs capable of making chis using its 2nm process technologies, TSMC is poised to offer vast 2nm capacity for years to come. TSMC expects to start HVM using its N2 process technology that uses gate-all-around (GAA) nanosheet transistors around the second half of 2025. TSMC's 2^nd generation 2nm-class process technology -- N2P -- will add backside power delivery. This technology will be used for mass production in 2026. Source: TSMC PRINT THIS ARTICLE * Post Your Comment [ ] [ ] [ ] [ ] [ ] [ ] [ ] [ ] [ ] Please log in or sign up to comment. [ ] [Submit Comment] [ajax-loade] POST A COMMENT 12 Comments View All Comments * Threska - Friday, January 19, 2024 - link Build on a boat, so if things hit the fan, they can just float away from the mess. Reply * twtech - Friday, January 19, 2024 - link Or, China could steal the boat and tow it back to the mainland. Reply * drwho9437 - Friday, January 19, 2024 - link TSMCs fabs are nearly worthless to China. The day they invade the service contracts are toast. Without service all the tools will be dead within a month maybe two. Well they will just copy them I hear you say. If it were that easy they would have their on ALDs, EUV steppers and more. They don't because it isn't easy. The damage an invasion would do to the world economy would be very great, but the world is now building capacity elsewhere. People forget Korea quite a lot. Micron, Intel and GF matter quite a lot too. But yes the world will be in trouble without UMC and TSMC; but then so much manufacturing of so many things is done in China I'm not sure chips would be the first things on people's lips. It would be pharmaceutical precursors probably. Nitrile rubber. Remember masks? Anyway you can't really steal and take over a foundary unless everyone agreeing to keep it alive stays on board and given it is mostly Japanese, EU and US firms that isn't going happen. Reply * sharath.naik - Saturday, January 20, 2024 - link It does not matter as, TSMC is only the manufacturer. The tool used to manufacture is still built in EU. So, if things hit the fan, then China will have the existing machines, but only until it breaks down. Reply * Piotrek54321 - Friday, January 19, 2024 - link The bleeding edge will remain in Taiwan, as it ensures its independence. If not for the semiconductor industry, I believe China could've already invaded. Reply * StevoLincolnite - Friday, January 19, 2024 - link Just imagine how much of a mess the market would become if China did disrupt Taiwans chip manufacturing. Would make the COVID+Crypto craze seem like childs play. Reply * Threska - Friday, January 19, 2024 - link China has a "water" problem. https://youtu.be/oupSYGUL0dE Reply * sharath.naik - Saturday, January 20, 2024 - link No, it's happening within 10 years. At least that is the plan, given that China pulled bizarre shenanigans to stir trouble on Indian border to use it as an excuse to break agreements and build troops on the border. There is only one reason that makes sense, they need troops on that border (guarding the flank) when they launch their action on Taiwan with most of their troops. Reply * my_wing - Friday, January 19, 2024 - link Don't hide TSMC management stupidity anandtech https://finance.technews.tw/2023/10/19/tsmc-qa/ "Having said that, our internal assessments show that our N3P, now I repeat again, N3P technology demonstrated (a) comparable PPA to 18A, my competitors' technology. But with an earlier time to market, better technology maturity and much better cost." Mark Liu and CC Wei @ TSMC = Bob Swan @ Intel Please do make this stupidity go away unnoticed, report it as it is, Backside Power Delivery is bring noticeable advantage in density and power efficiency. How can N3P compete with Intel 18A. A 2NM fab without EUV High NA so what is this different to Intel Ireland Fab 34? TSMC is no longer the bleeding edge, it should be call leading edge. Reply * drwho9437 - Friday, January 19, 2024 - link Intel is most likely going to be on par and have backside power first. I get quite annoyed with writeups that bracket the relabeled Intel 4 nodes as (formerly 7 nm). These lengths are fantasies. Intel 4 is about TSMC 4 in density and other metrics. The relabeling is basically fair though no two nodes is exactly the same. Who will deliver good GAA devices in volume first is really the next milestone. Samsung already has limited volume of them, I believe I read yields are rather bad. The other milestone is backside power. Intel's coming nodes have them both. High-NA EUV should improve yield on 18 A even if they don't start with it. I don't think ASIC designers are dumb, if Intel 20A and 18A are good I expect a ton of AI ASICs on it. Qualcom seems an obvious user as do Amazon, and Microsoft. Tesla? the RISC V companies? Nvidia, Apple and AMD are trickier given their long relationships with TSMC. If we don't see some of the first list taping out major chips on Intel 20A/18A and instead going for TSMC 3 nodes we will know. We will also know by Lunar Lake or the chip that follows it (I know one Lunar Lake version will be done on TSMC node), but Intel's own choices will show the what 18A and 20A are best for. Reply * 1 * 2 * > PIPELINE STORIES + Submit News TSMC 2nm Update: Two Fabs in Construction, One Awaiting Government Approval [dell_revea] TSMC Posts Q4'23 Earnings: 3nm Revenue Share Jumps to 15%, 5nm Overtakes 7nm For 2023 Apple to Cut Blood Oxygen Feature from Newly-Sold Apple Watches in the U.S. * AMD Rolls Out Radeon RX 7900 XT Promo Pricing Opposite GeForce RTX 40 Super Launch * Seagate Unveils Mozaic 3+ HDD Platform as HAMR Readies for Volume Ramp * Synopsys to Acquire Ansys: Set to Offer EDA, Analysis, and Simulation Tools * Network-Attached Storage Market Update: ASUSTOR, Terramaster, and QNAP Introduce New NAS Units * EK Reveals All-In-One Liquid Cooler for Delidded CPUs * Asus Unveils Dual-Screen Laptop: Zenbook Duo with two 14-inch OLED Displays * Frore Unveils AirJet Mini Slim: Solid-State Active Cooler Gets Slimmer and Smarter * Micron at CES 2024: USB4 SSD Technology Demonstrations * MSI Announces the Claw: A Handheld PC Game Console with Intel's Meteor Lake Inside LINKS * Home * About * Forums * RSS * Pipeline News * Bench * Terms of Use * Contact Us * * TOPICS * CPUs * Motherboards * SSD/HDD * GPUs * Mobile * Enterprise & IT * Smartphones * Memory * Cases/Cooling/PSU(s) * Displays * Mac * Systems * Cloud * Trade Shows * Guides FOLLOW * [icon-faceb]Facebook * [icon-twitt]Twitter * [icon-rss2]RSS The Most Trusted in Tech Since 1997 * About * Advertising * Privacy Policy purch Copyright (c) 2024. 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