Subj : SK Hynix's HBM4 will be the first out of the gate for Nvidia's Ru
To   : All
From : TechnologyDaily
Date : Mon Sep 15 2025 22:45:09

SK Hynix's HBM4 will be the first out of the gate for Nvidia's Rubin AI GPU, 
leaving Samsung and Micron in its wake

Date:
Mon, 15 Sep 2025 21:41:00 +0000

Description:
SK Hynix becomes the first company to finish developing HBM4 memory and 
announces plans for mass production ahead of Samsung and Micron.

FULL STORY
======================================================================SK 
Hynix completes HBM4 development and prepares technology for mass production 
Nvidia Rubin AI processors expected to feature SK Hynixs new HBM4 chips HBM4 
doubles connections and improves efficiency by 40 percent 

South Korean memory giant SK Hynix says it has completed development work on 
HBM4 and is now preparing the technology for mass production. 

This puts it ahead of rivals Samsung and Micron , who are still developing 
their own versions. 

The chips are expected to feature in Nvidias next-generation Rubin AI 
processors, and will play an important role in powering future artificial 
intelligence workloads. Beyond the AI infrastructure limitations 

Joohwan Cho, Head of HBM Development at SK Hynix, said: Completion of HBM4 
development will be a new milestone for the industry. By supplying the 
product that meets customer needs in performance, power efficiency and 
reliability in timely manner, the company will fulfill time to market and 
maintain competitive position. 

High Bandwidth Memory, or HBM, stacks layers of DRAM vertically to accelerate 
data transfer. 

Demand for high bandwidth memory has risen with the surge in AI workloads, 
and energy efficiency has become a pressing concern for data center 
operators. 

HBM4 doubles the number of I/O connections compared with the previous 
generation and improves power efficiency by more than 40%. 

The Korean memory maker says this translates into higher throughput and lower 
energy use in data centers, with service performance gains of up to 69%. 

HBM4 surpasses the JEDEC industry standard operating speed of 8Gbps by 
running above 10Gbps. 

SK Hynix adopted its advanced MR-MUF process for stacking chips, which 
improves heat dissipation and stability, along with the 1bnm process 
technology to help minimize manufacturing risk. 

Justin Kim, President and Head of AI Infra at SK Hynix, said: We are 
unveiling the establishment of the worlds first mass production system of 
HBM4. HBM4, a symbolic turning point beyond the AI infrastructure 
limitations, will be a core product for overcoming technological challenges. 
We will grow into a full-stack AI memory provider by supplying memory 
products with the best quality and diverse performance required for the AI 
era in a timely manner. You might also like SK Hynix chief says AI memory 
market set to boom as demand rises Samsung archrival discloses more details 
about key AI memory tech, MBM4 Micron wants a bigger slice of the $100 
billion HBM market with its 2026-bound HBM4



======================================================================
Link to news story:
https://www.techradar.com/pro/sk-hynixs-hbm4-will-be-the-first-out-of-the-gate
-for-nvidias-rubin-ai-gpu-leaving-samsung-and-micron-in-its-wake


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